IC Socket Base 20 Pin

Description

IC Socket
Base 20 Pin

The IC Socket Base 20 Pin DIP is a precision‑engineered through‑hole socket designed to securely hold 20‑pin dual‑in‑line package (DIP) integrated circuits without soldering the IC directly to a printed circuit board (PCB). This socket provides a reliable electrical and mechanical connection between the IC and the PCB, enabling easy insertion, removal, replacement, and maintenance of electronic components during development, testing, or field servicing. The dual‑row configuration accommodates standard 20‑pin DIP devices with a 2.54 mm (0.1 inch) pin pitch, making it suitable for a broad range of logic chips, microcontrollers, memory devices, and other DIP‑20 packaged ICs.

Specifications:

Number of Pins:
20

Package Type:
Dual In-line Package (DIP)

Pin Pitch:
2.54mm (0.1 inch)

Material:
Black thermoplastic with tin-plated alloy contacts

Operating Temperature Range:
Typically -25°C to 85°C

Applications:

Prototyping:
Ideal for experimental circuit designs requiring frequent IC changes.

Testing:
Facilitates easy swapping of ICs during testing phases.

Repair and Maintenance:
Allows for quick replacement of faulty ICs in existing circuits.

Educational Projects:
Useful in educational settings for hands-on learning and experimentation.

Package Include:

1x
IC Socket Base 20 Pin DIP.