Description
Here is the organized product description for the TES1-6308 / TEC1-6308 Rectangular Thermoelectric Peltier Cooler Module.
Product Overview
The TES1-6308 (often designated as TEC1-06308) is a high-performance, rectangular solid-state thermoelectric cooling module. Constructed using premium Bismuth Telluride semiconductor couples and durable aluminum oxide ($Al_2O_3$) ceramics, it transfers heat from one side to the other when a DC current is applied.
With its distinct elongated 40mm x 20mm (4x2cm) form factor, this module is specifically engineered to fit narrow, rectangular components. It delivers a significant step up in cooling capacity compared to lower-amperage versions, pumping up to 32W–37W of heat for fast and effective temperature control.
Technical Specifications
| Parameter | Specification |
| Model | TES1-6308 / TEC1-06308 |
| Dimensions | $40\text{mm} \times 20\text{mm} \times 3.9\text{mm}$ |
| Couples (P-N Junctions) | 63 |
| Max Current ($I_{max}$) | 8A to 8.5A |
| Max Voltage ($V_{max}$) | ~7.4V to 7.6V DC |
| Max Cooling Power ($Q_{max}$) | ~32W to 37.5W ($\Delta T = 0^\circ\text{C}$) |
| Max Temperature Difference ($\Delta T_{max}$) | $\ge 63^\circ\text{C}$ to $67^\circ\text{C}$ |
| Internal Resistance | ~0.65Ω to 0.75Ω |
| Wire Lead Length | ~150mm (typically 20AWG tinned copper) |
Key Features
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High-Current Performance: Operating at up to 8A, it provides a much higher heat-pumping capacity ($Q_{max}$) than the 6306 variant, making it ideal for more demanding thermal tasks.
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Optimized Rectangular Geometry: The 4x2cm footprint perfectly matches linear, narrow components—such as laser arrays or rectangular microchips—ensuring zero wasted cooling surface.
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Dual-Directional Control: By simply reversing the DC power polarity, the module seamlessly switches from cooling to heating, allowing for ultra-precise temperature stabilization.
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Noiseless & Reliable: Lacking moving parts or fluids, this solid-state chip functions silently, eliminates mechanical vibrations, and features a long operational lifespan.
Common Applications
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High-Power Laser & Photonics Systems: Cools high-performance laser diode bars, optical transmitters, and advanced sensory arrays that generate heavy localized heat.
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Medical & Beauty Equipment: Frequently integrated into professional skincare cooling devices, laboratory diagnostics, and clinical thermal cycling apparatuses.
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Advanced Electronics Cooling: Used for localized heat-spot reduction on rectangular components, power transistors, and customized CPU/GPU test blocks.
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Liquid Chillers: Compact heat exchangers and water blocks designed for specialized overclocking or analytical instruments.
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