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Home Breadboards & PCB'S ZY-208 Solderless Breadboard – 3220 Tie Point
PCB Board Fiber FR2 10*10cm
PCB Board Fiber FR2 10*10cm 30 EGP
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Breadboard Soldless 2390 Tie-points ZY-206
Breadboard Soldless 2390 Tie-points ZY-206 325 EGP

ZY-208 Solderless Breadboard – 3220 Tie Point

475 EGP

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Description

Description

ZY-208 Solderless Breadboard – 3220 Tie Point

The ZY-208 is a large-format, high-capacity prototyping board designed for complex electronic circuit assembly, debugging, and educational R&D. By providing a massive workspace without the need for permanent soldering, it allows engineers, students, and hobbyists to build, test, and modify sophisticated circuit designs rapidly.

Technical Specifications

Feature Specification
Total Tie-Points 3220
Configuration 4 Terminal Strips (2520 points) + 7 Distribution/Power Strips (700 points)
Binding Posts 4
Base Plate Powder-coated black steel/aluminum with rubber feet
Material ABS plastic (board), Phosphor bronze with nickel plating (clips)
Dimensions Approx. 23.5cm x 20.5cm
Wire Compatibility 20–29 AWG (recommended 20–26 AWG solid-core wire)
Pitch 2.54mm (0.1″) standard

Key Features

  • Expansive Prototyping Area: With 3220 tie points, this board is ideal for large-scale projects involving microcontrollers (Arduino, ESP32, Raspberry Pi), multiple sensor arrays, and complex logic circuits that would not fit on standard smaller breadboards.

  • Sturdy Foundation: Unlike basic breadboards, the ZY-208 comes mounted on a heavy-duty, powder-coated metal base. This provides excellent stability and prevents the board from sliding or flexing during component insertion.

  • Reliable Connectivity: The internal spring clips are made from nickel-plated phosphor bronze, ensuring durable electrical contact and resistance to corrosion over repeated use.

  • Flexible Power Distribution: The seven distribution strips allow for easy management of multiple voltage rails (e.g., 3.3V, 5V, 12V, and GND) across the board, which is essential for complex mixed-signal systems.

  • Reusable & Modular: Components can be moved, removed, or swapped instantly. The board layout is color-coded to help with organized component placement and circuit tracing.

Best Practices for Use

  • Wire Selection: For the most reliable connections, use solid-core jumper wires. Stranded wires can be difficult to insert and may damage the internal spring clips over time.

  • Cleanliness: To maintain low contact resistance, ensure that component leads are clean and free of oxidation or solder residue before insertion.

  • Heat Sensitivity: While the ABS plastic is durable, avoid using high-temperature tools directly on the breadboard, as the plastic can melt or warp.

  • Organized Prototyping: Use the color-coded rails to keep your power distribution consistent. This helps reduce accidental short circuits when working on dense designs.

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