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Home Breadboards & PCB'S Mini BreadBoard 400 Connection Point
ZY-204 Solderless Breadboard – 1660 Tie Point
ZY-204 Solderless Breadboard – 1660 Tie Point 275 EGP
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Tiny Breadboard 170 Tie Point – Black
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Mini BreadBoard 400 Connection Point

30 EGP

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Description

Description

Mini Breadboard – 400 Tie Points

The 400-Point Mini Breadboard is the quintessential tool for electronics hobbyists, students, and engineers. Its compact, adhesive-backed design makes it perfect for portable projects, sensor testing, and final-stage circuit integration where space is at a premium.

Technical Specifications

Feature Specification
Total Tie-Points 400
Configuration 300 terminal points + 100 power distribution points
Dimensions 8.2cm x 5.5cm x 0.85cm
Material White ABS plastic (housing), Phosphor bronze (contact clips)
Adhesive Backing Included (allows for mounting to enclosures or project boxes)
Interlocking Yes (sides have slots to snap multiple boards together)
Wire Compatibility 20–29 AWG (Solid-core wire recommended)

Key Features

  • Modular Design: Each board features interlocking tabs, allowing you to “snap” multiple 400-point breadboards together to expand your workspace as your project grows.

  • Compact Footprint: Ideal for small-scale projects using a single microcontroller or a handful of discrete components. It fits easily into small project enclosures.

  • Peel-and-Stick Backing: The underside features a high-quality adhesive tape, allowing you to permanently mount your circuit inside a project box or onto a chassis once the testing phase is complete.

  • Standardized Layout: Features two side power rails and a central terminal area, perfectly suited for standard DIP (Dual Inline Package) integrated circuits.

Best Practices for Use

  • Solid-Core Wire Only: To ensure the longevity of the internal nickel-plated spring clips, use 22-24 AWG solid-core jumper wires. Avoid stranded wires, as they can cause “burrs” that damage the contacts.

  • Component Insertion: When inserting sensitive components like microcontrollers or sensors, ensure they are aligned correctly. Applying excessive force at an angle can bend the internal clips.

  • Clean Leads: If you are reusing components that were previously soldered, ensure there is no residual solder on the leads before inserting them, as this can degrade the spring contact.

  • Avoid Soldering: Never apply a soldering iron to the breadboard. If you need to combine components, perform the soldering on a piece of perfboard or a breakout board first, then plug the finished assembly into the breadboard.

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